Ever smaller, ever more performant: The trend toward miniaturization of components is an ongoing challenge. Where every millimeter counts, the new 1-LY11-0.3/120 micro strain gage ensures significant reliability while requiring only a minimum of space.

With a carrier size of only 2 mm x 1.2 mm the micro strain gage opens up many fields of application in research and development. For example, when testing the stability of printed circuit boards.

New technologies and requirements, for example in mobile phone networks, provide ever smaller printed circuit boards – in some cases they measure only 10 x 10 mm. The microscopic LY-11-0.3/120 strain gage can be installed even on a fully equipped printed circuit board for measuring strain.

Other fields of applications include measurement in notches and bore holes as well as between rivets – a task often found in aircraft construction. As a basic principle: Wherever space is a constraint, the LY-11-0.3/120 micro strain gage is available to ensure reliable test results at HBM’s renowned high quality.