The EP250 hot-curing adhesive is no longer offered by HBM.

We offer the following alternative products for your consideration:

-         X280 adhesive (hot curing) for strain gauge measurements on smooth and porous materials

-         EP310S adhesive (hot curing) for strain gauge measurements at high temperatures

-         X60 adhesive (cold curing) for use in strain gauge measurements at low temperatures and on porous materials