Manufacturing & Monitoring
The EP250 hot-curing adhesive is no longer offered by HBM.
We offer the following alternative products for your consideration:
- X280 adhesive (hot curing) for strain gauge measurements on smooth and porous materials
- EP310S adhesive (hot curing) for strain gauge measurements at high temperatures
- X60 adhesive (cold curing) for use in strain gauge measurements at low temperatures and on porous materials