The EP250 hot-curing adhesive is no longer offered by HBM.

We offer the following alternative products for your consideration:

-        X280 adhesive (hot curing) for strain gauge measurements on smooth and porous materials

 

-         EP310S adhesive (hot curing) for strain gauge measurements at high temperatures

-         X60 adhesive (cold curing) for use in strain gauge measurements at low temperatures and on porous materials

Product Literature

主题/描述语言
技术参数表
German
English
Russian
使用说明
French, English, German
Italian
Declaration of Conformity
English, German

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