***If you have an existing HBMshop login you can use the same information to login to HBM.com
This webinar has been recorded and was originally held on December 12, 2017 at HBM. Please login to access the recording.
Printed Circuit Boards (PCBs) are exposed to high mechanical load during the production and mounting process. These single events can pre-damage the board or the components mounted on the board and lead to a failure in the field. By measuring the stress in these processes, you can uncover potential weak points, improve the process and thus help improve the product quality. This webinar will discuss the problems you may encounter while stress testing PCBs and how to solve them. We will review how to minimize the issues by choosing the right equipment, knowing how and where to apply the strain gauges and how to interpret the measuring results.