eDAQXR-lite EXRLCPU installation on eDAQ-lite layers
NOTE
Before disconnecting your eDAQ-lite CPU layer, update the firmware of legacy conditioning layers to current firmware levels.
NOTE: ELCOM and GPS on ELDIO are not supported by the eDAQXR-lite CPU.
• ELCOM – Not supported
• ELDIO – V1.9 (GPS not supported)
• ELHLS – V1.1
• ELNTB – V1.0
• ELBRG – V1.2
Keep standoffs with each conditioning and main processor layer. Some layers have unique standoffs.
The power input on the eDAQXR-lite CPU is designed to be isolated. Connecting the minus side of the input power to signal ground may result in an internal fault that will need factory repair. Refer to the User manual section on power and grounding for more detail.
The 1-ELBAT-2, 1-ELBAT2-2, 1-ELBAT-CE-2 or the 1-ELBAT-2-CE-2 (optional battery module attaching to the eDAQ-lite) cannot be used with the 1-EDAQXRL-64-2 system. Connecting an ELBAT to the 1-EDAQXRL-64-2 will render the 1-EDAQXRL-64-2 inoperable so it will need to be sent to Service for repair.
CAUTION
The person performing the installation should read this document in its entirety prior to performing any steps. If any portion of the installation process is not clear or the user is not comfortable performing the required sequence of actions, contact HBM Customer Service. Undertaking addition of new layers to an eDAQ-lite stack by someone other than an HBM technician is done at the customer’s own risk. Damage to the stack can occur and is the sole responsibility of the customer.
If this risk is unacceptable, contact HBM Customer Service and request an RMA for installation of an eDAQXR-lite EXRLCPU on eDAQ-lite layers.
Adding an eDAQXR-lite main processor to eDAQ-lite layers
Required tools: #1 flat blade screw driver and 2.5mm ball hex driver (SO-123-1003006)
CAUTION
Failure to comply with safety requirements could result in bodily injury or damage to property. Only disassemble layers in ESD safe conditions. Install only one data processor layer on an eDAQ-lite layer stack.
NOTE
An eDAQXR-lite main processor can support eight connected eDAQ-lite layers. Every layer in an eDAQ-lite stack must have a unique address (set using appropriate jumpers).
CAUTION
Backup capacitors of the EXRLCPU charge while power is supplied. After power supply is removed, the EXRLCPU lights the yellow LED until the charge depletes. Opening the CPU while the capacitors are charged exposes voltage potentials. Any object shorting these voltages could damage the EXRLCPU.
See Compatible layer addressing
- Turn off the eDAQ-lite main processor using the power switch and disconnect the power supply from the power connector.
- Remove four (4) flat-head screws (A) and the lid (B) from the top of the eDAQ-lite stack.
NOTE
One O-ring or gasket must be present under each legacy layer and the legacy eDAQ-lite lid. Newer, CE-compliant layers contain an O-ring installed in a groove on the bottom of the layer or lid. Older, non-CE-compliant layers use a foam gasket and have no groove. Be careful to use only one correct O-ring or gasket. Some layers have unique standoffs. Keep standoffs with each layer.
- Remove conditioning layers from the eDAQ-lite stack for use with the eDAQXR-lite main processor (H).
- Make sure each layer is set with a unique address using appropriate jumpers (C). Make sure jumper addresses ascend from low to high (1, 2, 3...) over the main processor. The layer with the lowest address (1) is the closest to the main processor.
NOTE
If legacy and New-design layer rings are in a stack, the IP rating for the devices may be impacted. Always install standoffs (E) when using legacy layers in a stack.
- Legacy layers (D) only: Install the four (4) standoffs (G (SO-257-1003660)) on the eDAQXR-lite base using four (4) flat head screws (F). Before installing a legacy layer ring, install four (4) guiding standoffs (E) using a flat blade screwdriver.
New-design layers (J) only: Install four (4) screws (L) in each conditioning layer using the hex driver (SO-123-1003006). Alternate screw positions between layers.
Mixed layers stack (D and J): First install New-design layers (J) on the eDAQXR-lite using hex head screws (L) and the hex driver (SO-123-1003006). Install the four (4) standoffs (G) on the eDAQXR-lite base using four (4) flat head screws (F), then install standoffs (E) and legacy conditioning layers (D). - Carefully align the pins and connectors and install a layer on the stack. Use care not to put undue strain on each layer. Repeat for each layer as necessary until all layers are attached.
- Be careful not to scratch the lid. Legacy layers (D) only or Mixed layers stack (D and J): Install the lid (B) on the stack using four (4) screws (A), the standoffs (E and G) and screws (F).
New-design layers (J) only: Install the lid (K) using four (4) screws (L) and the hex driver. - Connect the eDAQXR-lite main processor to an 8–36 VDC power supply using the power cable (1-EXR-PWR-PT-2).
- The system is now ready for use.
New-design layer rings may be installed on legacy ELBRG, ELDIO, ELHLS and ELNTB printed circuit boards. The New-design ring and captive screws provide an improved seal with the eDAQXR-lite CPU. Conditioning layer boards in new-design rings are available for purchase as 1-EXRL-BRG-120-2, 1-EXRL-BRG-350-2,
1-EXRL-DIO-B-2, 1-EXRL-HLS-2 or 1-EXRL-NTB-2.