NOTE
Before disconnecting your legacy eDAQ MPB layer, update the firmware of conditioning layers to the proper firmware levels.
If there is a DIO layer present, the firmware cannot be the 2VBC firmware. Check the firmware version via the web browser. If the firmware version number starts with DIO_2VBC, you must reflash the firmware to normal DIO firmware before installing the eDAQXR. Both firmware versions are included in the eDAQ firmware files on the user’s computer (normally located at “C:/Program Files (x86)/SoMat/eDAQ Firmware”).
Make sure the stack does not contain eDAQ legacy layers ELLB, EHLB or an ECOM layer. These layers are not supported by the eDAQXR. The eDAQXR EXRCPU supports only EDIO, EBRG, EHLS, ENTB and EITB layers.
The power input on the eDAQXR CPU is designed to be isolated. Connecting the minus or positive side of the input power to chassis with legacy eDAQ layers installed may result in an internal fault that will need factory repair. Refer to the User manual section on power and grounding for more detail.
The 1-ELBAT-2, 1-ELBAT2-2, 1-ELBAT-CE-2 or the 1-ELBAT-2-CE-2 (optional battery module attaching to the eDAQ) cannot be used with the EDAQXR system. Connecting an ELBAT to the EDAQXR will render the EDAQXR inoperable so it will need to be sent to Service for repair.
CAUTION
The person performing the installation should read this document in its entirety prior to performing any steps. If any portion of the installation process is not clear or the user is not comfortable performing the required sequence of actions, contact HBM Customer Service. Undertaking addition of new layers to an eDAQ stack by someone other than an HBM technician is done at the customer’s own risk. Damage to the stack can occur and is the sole responsibility of the customer.
If this risk is unacceptable, contact HBM Customer Service and request an RMA for installation of an eDAQXR EXRCPU on eDAQ layers.
Adding an EXRCPU to eDAQ layers
The interface for installing an EXRCPU on eDAQ layers (1-EXR-E-ADT-2) (B) and six (6) 30mm screws may be purchased separately from the EXRCPU. The interface is included in EXRCPU kits 1-EXR-E-32GB-2 and 1-EXR-E-64GB-2.
Required tools: #1 Phillips screw driver and 2.5mm ball hex driver (SO-123-1003006)
CAUTION
Failure to comply with safety requirements could result in bodily injury or damage to property. Only disassemble layers in ESD safe conditions. Install only one data processor layer on an eDAQ layer stack. Do not install an EXRCPU on the interface before installing the interface on an eDAQ layer. Interface screw holes are only accessible before the EXRCPU is installed on the interface. High retention power connectors are used, therefore EXRCPU installation and removal may require some added force.
NOTE
An EXRCPU can support eight connected eDAQ layers. Every layer in an eDAQ stack must have a unique address (set using appropriate jumpers).
See Compatible layer addressing for more information about correctly installing jumpers on a compatible eDAQ conditioning layer for a unique layer address.
NOTE
To retain the ball hex driver
Slide the driver under the screw and wedge the handle against the top of the lower case.