Adding legacy eDAQ layers to a stack
See eDAQXR EXRCPU installation on eDAQ layers for instructions about installing an eDAQXR CPU on an assembled legacy eDAQ conditioning layer stack.
CAUTION
Read through this section in its entirety prior to performing any steps. If any portion of the installation process is not clear or is not comfortable to perform, ship the CPU and layers to HBM customer service for the installation. If done improperly, the addition of new layers can cause damage to the eDAQXR system and any damage is the sole responsibility of the customer.
CAUTION
Before disconnecting your legacy eDAQ MPB layer, update the firmware of conditioning layers to the proper firmware levels.
If there is a DIO layer present, the firmware cannot be the 2VBC firmware. Check the firmware version via the web browser. If the firmware version number starts with DIO_2VBC, you must reflash the firmware to normal DIO firmware before installing the eDAQXR. Both firmware versions are included in the eDAQ firmware files on the user’s computer (normally located at “C:/Program Files (x86)/SoMat/eDAQ Firmware”).
Make sure the stack does not contain eDAQ legacy layers ELLB, EHLB or an ECOM layer. These layers are not supported by the eDAQXR. The eDAQXR EXRCPU supports only EDIO, EBRG, EHLS, ENTB and EITB layers.
CAUTION
Failure to comply with safety requirements could result in bodily injury or damage to property.
Only disassemble layers in ESD safe conditions.
There cannot be more than one CPU in a stack.
If building up a stack with legacy conditioning layers, always remove J2 and J3 connector adapters from the lowest layer above the base. Failure to remove these adapters may allow them to fall from the connectors and cause damage to the layer.
Backup capacitors of the EXRCPU charge while power is supplied. After power supply is removed, the EXRCPU lights the yellow LED until the charge depletes. Opening the CPU while the capacitors are charged exposes voltage potentials. Any object shorting these voltages could damage the EXRCPU.
Adding a layer requires an eDAQ stack, the desired eDAQ layer, a #1 Philips head screwdriver and a 2.5-mm hex driver.
Install a base (without a battery) under the bottom eDAQ conditioning layer using six (6) screws. An optional base kit (1-EBASE-EXRCPU-2), including six (6) 30mm screws, is sold separately.
To add a layer to an eDAQ stack:
- Power down the CPU and disconnect the power supply.
- Remove the screws, eDAQXR EXRCPU and interface (1-EXR-E-ADT-2) from the eDAQXR stack or the eight screws and top plate from the eDAQ stack.
- To remove layer to reach a specific location within the stack, remove the six (6) HM3x30MM-Custom (A) from the side rails of the layer and then remove the layer. Note: The screws may be loosened from a layer and left in the removed layer as alignment guides for layer connection. Remove layers as needed to get access to the desired position within the stack.
- Install the J2x36-.635MF100 (B) and the J3x36-.635MF100 (C) onto the bus connectors of a board (on the underside near the JP1 layer address pins), as shown in the picture above. The third row of the J3x36-.635MF100 connector (C) should be placed as a spacer in between the rows of bus pins (i.e. no pins making connection). A J3 and a J2 are recommended because using two J2 adapters can tilt, contributing to misalignment. Be sure that the pins are properly aligned and that the connectors sit down onto the board. Improperly aligned bus pins will damage the boards. Gently tilt a J2 or J3 adapter left and right to remove it from a board, because rocking the adapter from end to end may bend pins.
- Set the layer address for a board using the blue J1x2F jumpers (D) installed on the underside of the layer. The jumper pins are located opposite the serial number and near the layer connectors. For more information on eDAQ layer addresses, see Compatible layer addressing.
- To ensure alignment is correct, remove the four (4) HM3x12MM-FHNY screws (E) from the back panel of the eDAQ layer. Remove the back panel to provide a clear view for aligning the bus pins. Be careful not to damage or tear the gasket.
- Align the bus connectors of the new layer with the bus pins of the layer below. The pins must be aligned correctly. Improper alignment damages the layer on power-up.
- Press the board and ring onto the eDAQ stack. Use care not to put undue strain on the board. Repeat for each layer as necessary until all layers are attached.
- Replace the back panel and start the four (4) HM3x12MM-FHNY screws (E).
- Place the six (6) HM3x30MM-Custom (A) (or HM3x40MM-CS, used on the lowest layer into a base) into the holes and start all of them before tightening any single screw down. Note: The ring should match up with the stack and be flush on all sides. Make sure to start all the screws and then tighten the four (4) back panel screws (E) and the six (6) ring screws (A). The gasket should compress and the metal enclosures should be very close, if not touching.
- Repeat steps above for adding each additional layer until a complete stack is assembled.

